Vishay Introduces New Series of Lead-Free NTC Thermistor Bare Dies for Automotive IGBTs

Gasgoo News, June 29, Vishay Intertechnology announced a new series of lead-free NTC thermistor die (top and bottom contact) BCcomponents NTCC201E4, and provide designers with a variety of mounting options.The NTCC201E4 device with silver metallization supports aluminum wire bonding and is compatible with vacuum reflow soldering or formic acid/forming gas, SAC or SMP soldering, and nanosilver paste sintering.

The new devices are AEC-Q200 qualified, operate over a -55°C to +175°C temperature range, and are optimized for temperature sensing, control and compensation in automotive and alternative energy applications.The final product of this product may be IGBT (Insulated Gate Bipolar Transistor) and power MOSFET modules, as well as power inverters for electric vehicles (EV) and hybrid electric vehicles (HEV), solar panels and wind turbines.

The NTCC201E4 thermistor has two layers of top and bottom metallization.The outer layer has excellent resistance to solder leaching compared to previous generation devices, especially when using high melting point solders up to +360°C.And the formation of H2/N2 gas when the solder preform is used, and its inner layer is resistant to formic acid corrosion of the board.

These thermistors are RoHS compliant, halogen free, and Vishay Green compliant with resistances of 4.7 kΩ to 20 kΩ at +25°C (R25), tolerances as low as ± 1 %, and beta (B25/85) ranges from 3435 K to 20 kΩ 865 K tolerance down to ± 1 %.These devices have a maximum power dissipation of 50 mW, a response time of 3 seconds, and are packaged with PS plastic tape.